Home / products / ​​​thin wafer handling

Thin wafer handling
mechatronic systemtechnik gmbh offers handling solutions of thin wafers from a thickness of 50 µm, for power semiconductors and sensor applications. These substrates vary in materials, including silicon, III/V, and transparent materials. 

mechatronic systemtechnik gmbh's solutions include  :

 EFEM mWL for thin wafers  sorter mWS for thin wafers  packer mpt for thin wafers  ring cutter & remover mLC & mRR for wafers

Home / products / ​​​thin wafer handling

we can handle it