Manufacturers of power semiconductor devices often grapple with high breakage rates and signifi-cant financial losses due to stress-related damages during production. These issues not only hinder efficiency but also challenge chipmakers’ ability to meet stringent industry standards, particularly within the automotive sector. Yet, the introduction of disruptive laser-cutting and wafer handling technologies heralds a new era of possibilities. By meticulously addressing the underlying causes of stress-related failures, manufac-turers are empowered to elevate their yield, dramatically reduce defect levels, and ensure unwaver-ing compliance with the most exacting industry benchmarks.
Resolving Stress-Induced Failures: One such prominent Shanghai-based manufacturer successfully overcame several challenges with a high-performance laser system that seamlessly integrated precise power control and high-precision positioning, effectively preventing cracks and chipping. Through the adoption of mechatronic systemtechnik’s advanced mLC & mRR laser cutting and ring removing system, the manufacturer effectively resolved these challenges. This innovative solution not only ensured compliance with stringent automotive industry standards but also led to a significant reduction in defect levels. Founded 25 years ago, mechatronic systemtechnik GmbH has established itself as a high-tech industry leader specialising in automated handling systems for non-standard substrates and non-standard handling requirements. With over 500 systems installed worldwide, the company’s expertise spans mechanical, electrical, and control systems engineering.
The Problem The customer, a leading manufacturer of power semiconductor devices, encountered significant difficulties during the Insulated Gate Bipolar Transistors (IGBT) production process. The primary challenge lay in the removal of the TAIKO ring prior to the die separation step. The traditional method employed circular blades for cutting, which often resulted in micro-cracks and required excessive force to remove the ring. This caused stress-related damage to the dies and also led to substantial financial losses and difficulties in meeting the stringent yield requirements of the automotive industry. Among the key challenges faced were notably high breakage rates stemming from stress-related damages, which proved to be a significant hurdle. This was compounded by financial losses resulting from an alarming increase in defect levels. Additionally, the inability to meet the stringent yield requirements of the automotive industry added another layer of complexity to an already daunting situation. The Solution To address these issues, mechatronic systemtechnik implemented their state-of-the-art mLC & mRR laser cutting and ring removing system. This solution leveraged advanced mechatronic and laser technologies to provide maximum control and precision during the cutting and removal processes, significantly reducing stress on the fragile wafers.
The Problem
The customer, a
leading manufacturer of power semiconductor devices, encountered significant
difficulties during the Insulated Gate Bipolar Transistors (IGBT) production
process. The primary challenge lay in the removal of the TAIKO ring prior to
the die separation step. The traditional method employed circular blades for
cutting, which often resulted in micro-cracks and required excessive force to
remove the ring. This caused stress-related damage to the dies and also led to
substantial financial losses and difficulties in meeting the stringent yield
requirements of the automotive industry.
Among the key
challenges faced were notably high breakage rates stemming from stress-related
damages, which proved to be a significant hurdle. This was compounded by
financial losses resulting from an alarming increase in defect levels. Additionally,
the inability to meet the stringent yield requirements of the automotive
industry added another layer of complexity to an already daunting situation.
The Solution
To address these
issues, mechatronic systemtechnik implemented their state-of-the-art mLC &
mRR laser cutting and ring removing system. This solution leveraged advanced
mechatronic and laser technologies to provide maximum control and precision
during the cutting and removal processes, significantly reducing stress on the
fragile wafers.
Key Features of the Solution:
The system features
a high-performance laser that allows for precise control of laser power. It
also includes a mechatronic high-precision positioning system designed to
prevent cracks and chipping. Additionally, there is integrated measurement for
assessing cutting and removal performance. A camera system is employed to
recognize and align the wafer within the film frame, even when using
non-transparent tape. Furthermore, an exhaust system effectively eliminates
silicon condensation during the laser cutting process.
The mechatronic
chuck system features advanced lip seal technology designed for face-down processing.
It includes an integrated LED-based UV treatment system that utilizes a
rotating wafer and shielding rings to ensure maximum control over the UV dose.
Additionally, the system employs a circular movement that effectively minimizes
stress within the gap between the tape and the ring.
·
Handling Sequence:
Continuous
monitoring and sensing of wafers is conducted during each handling step,
accompanied by unique handshake procedures designed to ensure that no wafer is
lost or damaged.
Results
The implementation
of the advanced mLC & mRR system delivered remarkable results, enabling the
customer to meet stringent automotive industry standards while substantially
enhancing production efficiency. Key outcomes included achieving a throughput of
up to 60 wafers (12-inch) per hour, tailored to wafer thickness, and
consistently meeting the rigorous breakage rate requirements of the automotive
sector. The solution effectively eliminated micro-cracks and chipping,
resulting in smooth edge surfaces and significantly reduced defect levels at
the wafer edges. Additionally, it provided a more cost-effective solution with
lower capital expenditure and a reduced footprint compared to competing
technologies.
By leveraging
cutting-edge technologies and innovative solutions, the customer achieved
notable improvements in production efficiency, yield, and financial
performance. The ongoing partnership between mechatronic systemtechnik and the
customer promises further advancements in wafer handling and production
processes, and plans are underway to explore additional solutions from
mechatronic to continue enhancing the manufacturer’s capabilities and maintain
their competitive edge in the semiconductor industry.
Beyond this
individual case, many other manufacturers have also turned to mechatronic
systemtechnik’s advanced mLC & mRR system to address similar challenges.
These customers, too, have benefited from the system’s ability to streamline
production, reduce defects, and meet stringent industry standards. The
solution’s versatility and proven performance across a range of applications
demonstrate its value as a reliable and scalable option for companies looking
to enhance their wafer handling processes.
