Toward the end of the TAIKO wafer fabrication process, just before singulation, the TAIKO wafer is typically secured in a film frame for the subsequent removal of the TAIKO ring. Multiple sensors are integrated into this solution, as is common with most mechatronic products. The objective here is to ensure a clean cut on the incoming material and the complete removal of the ring. Mechatronic offers a system that accomplishes the ring removal with minimal physical stress to the wafer. With the wafer positioned face down during the removal process, defect levels are significantly reduced compared to other approaches.
