mechatronic systemtechnik gmbh’s proprietary end effectors, pre-aligners, mapping systems, and chucks are the reason why specialty handling approaches can be addressed. We have the ability to customize all components in our systems for various requests, to enable safe and reliable handling of nearly all substrate types used in power, sensor, and MEMS device manufacturing
As an additional service to our partners, mechatronicsystemtechnik gmbh offers its design know-how and fabrication processes by supplying inspection plates for the placement of the substrates on metrology and lithography equipment. With special proprietary technologies substrates (e.g. eWLP wafers), our chucks can handle a warpage of >10mm. The resulting flatness of the substrates when in the chuck can be below 10µm.